ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,225, issued on July 14, was assigned to Kioxia Corp. (Tokyo). "Semiconductor device and manufacturing method of the same" was invented by T... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,226, issued on July 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor packages" was invented by Hyoe... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,227, issued on July 14, was assigned to Sharp Display Technology Corp. (Kameyama City, Japan). "Active matrix device" was invented by Kohhe... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,228, issued on July 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package" was invented by Hongj... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,229, issued on July 14, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.). "Selective wire coating during wire bonding" was inve... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,231, issued on July 14, was assigned to SK hynix Inc. (Icheon-si, South Korea). "Stack packages" was invented by Eun Hye Do (Icheon-si, Sou... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,232, issued on July 14, was assigned to SK hynix Inc. (Gyeonggi-do, South Korea). "Stacked semiconductor device" was invented by Jae Hyung ... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,233, issued on July 14, was assigned to Micron Technology Inc. (Boise, Idaho). "Three-dimensional stacking semiconductor assemblies with ne... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,234, issued on July 14, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Display device" was invented by Seung Lyong Bok... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,235, issued on July 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Fine pitch chip interconnect struct... Read More